TSMC promises that its nodes will surpass Intel’s technology

DSMC It is comparing its new 3NP and N2 process nodes with 18A technologies Intel3NP has some improved features, while its 2nm node outperforms Intel in all aspects in terms of efficiency, performance and area (PPA) advantages.

Our internal assessment shows that our N3P […] has demonstrated certain properties [de potencia, rendimiento y área] Compare with 18A [de Intel]my competitor’s technology, but shorter time to market, more technological maturity and much better cost,” TSMC CEO CC Wei said on the company’s earnings call (via The Motley Fool). „In fact, let me repeat, our 2nm no-feedback (N2) The technology is more advanced than N3P and 18A, and will be the most advanced technology in the semiconductor industry when it is introduced in 2025.”

Intel’s 20A manufacturing technology, due in 2024, will be a breakthrough in terms of innovation as it will introduce ribbonfed gate-all-around transistors. as well as Backplane Power Delivery Network (BSPDN), two technologies designed to enable higher performance, lower power consumption and higher transistor density. Meanwhile, Intel’s 18A production node is slated to further develop 20A innovations and deliver new PPA developments in late 2024-early 2025.

In contrast, TSMC’s N3, N3E, N3P and N3X 3nm manufacturing processes are based on proven FinFET transistors and a traditional power supply network. The world’s largest foundry doesn’t seem to be in a hurry with its GAA nanosheet and BSPDN transistors, so the former will be introduced on TSMC’s N2 node, which will enter mass production in the second half of 2025. Included in the N2P, it will begin mass production by the end of 2026.

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One of Intel’s main goals in the coming years is to surpass DSMC in technology leadership and to win foundry orders from companies that need cutting-edge nodes. To this end, Intel plans to introduce three advanced manufacturing processes over the next five quarters and begin mass production of its 2nm and 1.8nm manufacturing technologies in the second half of 2024 (or early 2025). However, TSMC believes that even its N3P node, deployed in 2025, will offer a lower PPA comparable to Intel’s 18A. Even after a year of entering the market its N2 will surpass it.

Since TSMC hasn’t released many figures about its N3P and N2, it’s hard to draw conclusions about its competitiveness against Intel’s 18A. However, what is known is TSMC’s 3 nm nodes will incorporate FinFET transistors, while the 2 nm nodes will incorporate GAA transistors, with which the manufacturer will try to increase the performance and efficiency of the chips in the future.

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